JPH073557Y2 - 温度ヒューズ - Google Patents
温度ヒューズInfo
- Publication number
- JPH073557Y2 JPH073557Y2 JP9444688U JP9444688U JPH073557Y2 JP H073557 Y2 JPH073557 Y2 JP H073557Y2 JP 9444688 U JP9444688 U JP 9444688U JP 9444688 U JP9444688 U JP 9444688U JP H073557 Y2 JPH073557 Y2 JP H073557Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- thermal fuse
- insulating
- melting point
- low melting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 35
- 238000002844 melting Methods 0.000 claims description 19
- 230000008018 melting Effects 0.000 claims description 19
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- 239000011248 coating agent Substances 0.000 claims description 16
- 238000000576 coating method Methods 0.000 claims description 16
- 229910000743 fusible alloy Inorganic materials 0.000 claims description 15
- 238000007789 sealing Methods 0.000 claims description 14
- 239000011247 coating layer Substances 0.000 claims description 13
- 238000009413 insulation Methods 0.000 description 15
- 239000003822 epoxy resin Substances 0.000 description 5
- 230000004907 flux Effects 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Fuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9444688U JPH073557Y2 (ja) | 1988-07-15 | 1988-07-15 | 温度ヒューズ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9444688U JPH073557Y2 (ja) | 1988-07-15 | 1988-07-15 | 温度ヒューズ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0216541U JPH0216541U (en]) | 1990-02-02 |
| JPH073557Y2 true JPH073557Y2 (ja) | 1995-01-30 |
Family
ID=31318969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9444688U Expired - Lifetime JPH073557Y2 (ja) | 1988-07-15 | 1988-07-15 | 温度ヒューズ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH073557Y2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2511733B2 (ja) * | 1990-12-29 | 1996-07-03 | 内橋エステック株式会社 | 合金型温度ヒュ−ズ |
-
1988
- 1988-07-15 JP JP9444688U patent/JPH073557Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0216541U (en]) | 1990-02-02 |
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